We offer various tapes.
Dicing Die Bonding Tape
（for DBG™ Process）
DBG™＋LE Laser Cutting – chip to chip -
The indicated values are measured values and not intended for guarantee use.
| LE01D-7 | Measurement Method | ||
|---|---|---|---|
| Tape Thickness (µm) | 87 | Without Release Film | |
| Base Film Thickness (µm) | 80 | ||
| Adhesive Layer Thickness (µm) | 7 | ||
| Appearance | Brown | ||
| Pick Up Strength (N/5 mm X 5 mm) |
0.8 | ||
| Die Shear Strength (N/2 mm X 2 mm) |
130 (R.T.) | Adherent : Copper | |
| Glass transition temperature (ºC) | 172 | Elastic Data | |
| Storage Modulus (Pa) |
25ºC | 2.1 X 109 | Frequency : 11 Hz |
| 100ºC | 5.2 X 108 | ||
| 150ºC | 1.4 X 108 | ||
| 200ºC | 4.4 X 107 | ||
| 250ºC | 3.4 X 107 | ||
| CTE (ppm) | α1 | 79 | TMA |
| α2 | 150 | ||
| Moisture Absorption (wt%) | 0.7 -1.1 | MSL1 : 85ºC, 85%RH/168 hrs | |
| Heat Cure Condition | 120ºC/30 min + 140ºC/30 min | ||
UV irradiation condition
1) UV ray intensity : 220 mW/cm2 2) UV ray dosage : 160 mJ/cm2 3) Wave length of ultraviolet should be around 365nm.
*"DBG™" is trademark of LINTEC Corporation, Disco Corporation and KIOXIA Corporation.