We offer various equipment.
LC Tape Laminator
（300mm Fully-Automatic LC Tape Laminator）
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1．LC Tape laminator
This is an optimal system realized to meet the property of the backside coating tape (LC Tape), which is used in Flip Chip packaging.
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2．High-precision tape lamination attained
By applying Lintec's unique lamination mechanism, high-precision tape lamination without voids has been achieved.
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3．Internal tape pre-cutting mechanism
The internal tape pre-cutting mechanism cuts the tape to wafer size prior to lamination, preventing potential wafer edge damage caused by the cutter after lamination.
Options
- Host communication function
communication format: conforms to SECS-I and HSMS/Software: conforms to GEM - Double cassette loading
- Wafer ID reader
