1. Fully protects the wafer surface during back grinding and prevents wafer surface contamination from infiltration of grinding fluid and/or debris.
2. There is virtually no residual adhesive after tape is peeled off.
3. For cases in which slight contamination remains because of wafer surface configuration, the line-up includes a type that can be removed by cleaning with pure water. Additionally, there is no danger of contamination from cleaning fluids because there are no water-soluble ingredients of light molecular weight in the adhesive.
4. High precision tape thickness accuracy ensures precision wafer thickness after back grinding.
Standard (thickness: >75µm)
Thin Grinding (thickness: >50µm)
For questions or estimations about semiconductor related products, please feel free to contact us.