The Adwill LC Tape was developed to protect and reinforce the die backside in applications such as Flip Chip, in which the die is mounted onto a substrate from the circuit surface. While protecting and reinforcing the die backside, it also blocks light to minimize effects on the circuit surface. Since this product comes as a tape, uniformity in thickness can be maintained through simplified operations. Lamination can take place at relatively low temperatures so that the risk of circuit damage from heat is reduced.