Wafer Mounter （300㎜ Fully-Automatic Remounter）
1．Remounting process performed on one table
After cutting the tape that is mounted on the wafer, a new dicing tape is laminated onto the opposite side of the wafer; this entire process is performed on one table (transfer mount). Because the entire remounting process is performed on one table without releasing the adsorption, the risk of wafer cracking decreases allowing for the processability of thin wafers (≥30µm).
2．Tape cutting performed by a 6-axis robot
Cutting radius, speed, depth, angle, and heater (up to 90℃) are all freely adjustable allowing for optimal tape cutting.
3．Multiple different methods of remounting available
Standard: 12inch ring frame→12inch ring frame
Options: 8inch ring frame→8inch ring frame, 8 inch ring frame→12inch ring frame
4．Double load ports are standard
Different load ports can be used when loading/unloading a workpiece.
- Host Communication Function
(Communication Format:Conforms to SECS-I and HSMS/
Software:Conforms to GEM)
- Dicing Tape
- Vision System
(Wafer ID Reader & Barcode Attachment System)