We offer various equipment.

BG Tape Remover RAD-3000F/8 (200mm Fully-Automatic BG Tape Remover)

  1. 1.Ideal tape peeling

    This equipment applies the 180-degree tape peeling technique to peel back grinding tape from the wafer, minimizing stress on the wafer.

  2. 2.Automatic control of UV intensity and quantity of light

    The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light, which also enables stable peeling of UV curable back grinding tape.


  • Host communication function
    communication format: conforms to SECS-I and HSMS/Software: conforms to GEM

Suitable Tapes

Catalog (PDF) Download

For questions or estimations about semiconductor related products, please feel free to contact us.