Adwill LE Tape is a high value-added tape that enables both dicing and die bonding with a single sheet.It achieves stable die bonding without bleeding or die tilting, which can occur with liquid adhesives.
We offer various tapes.
Dicing Die Bonding Tape
（for Standard Process）
Features
- ・Supports the entire process from dicing to die bonding with a single tape
- ・No bleeding or die tilting caused by liquid adhesives
- ・Ideal for thin and stacked packages
LE Tape Method vs Liquid Adhesive Method
| LE Tape | Liquid Adhesive | |
|---|---|---|
| Adhesive Condition | Uniform over whole surface | Non-uniform, partial coverage |
| Effect on Die Size | No | Yes |
| Tool and Adhesive Layer Control | None required | Required |
| Bleeding of Adhesive During Curing | No | Yes |
| Adhesive Condition | |
|---|---|
| LE Tape | Uniform over whole surface |
| Liquid Adhesive | Non-uniform, partial coverage |
| Effect on Die Size | |
| LE Tape | No |
| Liquid Adhesive | Yes |
| Tool and Adhesive Layer Control | |
| LE Tape | No |
| Liquid Adhesive | Yes |
| Bleeding of Adhesive During Curing | |
| LE Tape | No |
| Liquid Adhesive | Yes |
Process Flow
expand
Tape Applications by Process
For Standard Process
For FOW
Suitable Equipment
Other lineups are also available. For details, please contact us.