Adwill LD Tape is dicing die bonding tape best suited for the DBG™ (Dicing Before Grinding) process. High quality adhesive layer cutting of “LD Tape” is achieved by using full cut laser dicing after applying dicing die bonding tape to separated dies in the DBG™ process.
We offer various tapes.
Dicing Die Bonding Tape
（for DBG™ Process）
Features
- ・Effective for ultra-thin chip manufacturing due to low pickup force characteristics
- ・Enables high-density and multi-stacked packages with an adhesive thickness of 7 µm
Process Flow
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Tape Applications by Process
DBG™＋LE Laser Cutting
Suitable Equipment
Other lineups are also available. For details, please contact us.
*"DBG™" is trademark of LINTEC Corporation, Disco Corporation and KIOXIA Corporation.