We offer various tapes.

Dicing Die Bonding Tape LD Tape (for DBG Process)

LD Tape

Adwill LD Tape is dicing die bonding tape best suited for the DBG (Dicing Before Grinding) process. High quality adhesive layer cutting of “LD Tape” is achieved by using full cut laser dicing after applying dicing die bonding tape to separated dies in the DBG process.

  1. 1. Easy pick-up allows it to be effective for ultra-thin dies.
  2. 2. Available in adhesive thickness of 5µm and 7µm, enabling high density and multi-stacked packages.

Product Information

DBG(Dicing Before Grinding) Type:Cure

Suitable Equipment

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