1．Compactly designed high performance remover

This equipment is suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.
*The equipment is compatible with both wafer and wafer mounted to ring frame.

2．Easy-to-operate semi-automatic type

Once the wafer is set on the peeling table, the peeling tape can be laminated and the back grinding tape removed automatically with simple control inputs.

3．Stable removing of BG Tape

Similar to the fully-automatic type, peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer's periphery, and it is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer, allowing the processing of thin wafers.