We offer various tapes.
BG Tape
（Non-UV type BG Tape）
For Standard Back Grinding Process
-Standard (>100 μm wafer)-
The indicated values are measured values and not intended for guarantee use.
| P-4205B | ||
|---|---|---|
| Tape Thickness(μm) | 205 | |
| Appearance | Blue | |
| Structure | Base Film (μm) | PO 165 |
| Adhesive (μm) | 40 | |
| Adhesion*1 (mN/25 mm) |
Before UV | 2440 |
*1: Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend=Si mirror wafer
For Standard Back Grinding Process
-Thin Wafer (>50 μm wafer)-
The indicated values are measured values and not intended for guarantee use.
| P-4140A | P-7125 | ||
|---|---|---|---|
| Tape Thickness(μm) | 140 | 125 | |
| Appearance | Opaque | Blue | |
| Structure | Base Film (μm) | PO 120 |
Special Elastomer 105 |
| Adhesive (μm) | 20 | 20 | |
| Adhesion*1 (mN/25 mm) |
Before UV | 780 | 2840 |
| Remark | Low Warpage | ||
*1: Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend=Si mirror wafer