We offer various tapes.
Dicing Die Bonding Tape
（for Standard Process）
For Standard Process -chip to chip-
The indicated values are measured values and not intended for guarantee use.
| LE5000S | LE04-10 | Measurement Method | ||
|---|---|---|---|---|
| Tape Thickness (µm) | 120 | 110 | Without Release Film | |
| Base Film Thickness (µm) | 100 | 100 | ||
| Adhesive Layer Thickness (µm) | 20 | 10 | ||
| Appearance | Milky-White | Dark Brown | ||
| Pick Up Strength (N/5 mm X 5 mm) |
1.1 | 1.0 | ||
| Die Shear Strength (N/2 mm X 2 mm) |
213 | 193 (23ºC) | Adherent : Copper | |
| Glass transition temperature (ºC) | 136 | 195 | Elastic Data | |
| Storage Modulus (Pa) |
25ºC | 1.8 X 109 | 1.9 X 109 | Frequency : 11 Hz |
| 100ºC | 6.9 X 108 | 8.2 X 108 | ||
| 150ºC | 6.0 X 107 | 2.8 X 108 | ||
| 200ºC | 3.9 X 107 | 4.9 X 107 | ||
| 250ºC | 3.8 X 107 | 2.8 X 107 | ||
| CTE (ppm) | α1 | 105 | 80 | TMA |
| α2 | 180 | 150 | ||
| Moisture Absorption (wt%) | 2.0 | 2.0 – 2.6 | MSL1 : 85ºC, 85%RH/168 hrs | |
| Heat Cure Condition | 160ºC/60 min | 160ºC/60 min | ||
UV irradiation condition
1) UV ray intensity : 220 mW/cm2 2) UV ray dosage : 160 mJ/cm2 3) Wave length of ultraviolet should be around 365nm.
For Standard Process -chip to substrate -
The indicated values are measured values and not intended for guarantee use.
| LE4424 | Measurement Method | ||
|---|---|---|---|
| Tape Thickness (µm) | 120 | Without Release Film | |
| Base Film Thickness (µm) | 100 | ||
| Adhesive Layer Thickness (µm) | 20 | ||
| Appearance | Transparent | ||
| Pick Up Strength (N/5 mm X 5 mm) |
0.9 | ||
| Die Shear Strength (N/2 mm X 2 mm) |
65 (R.T.) 8.8 (250ºC / 30 sec.) |
Adherent : Copper | |
| Glass transition temperature (ºC) | 53 | Elastic Data | |
| Storage Modulus (Pa) |
25ºC | 2.0 X 109 | Frequency : 11 Hz |
| 100ºC | 1.1 X 106 | ||
| 150ºC | 5.9 X 105 | ||
| 200ºC | 5.5 X 105 | ||
| 250ºC | 8.0 X 105 | ||
| CTE (ppm) | α1 | 99 | TMA |
| α2 | 195 | ||
| Moisture Absorption (wt%) | 0.7 | MSL1 : 85ºC, 85%RH/168 hrs | |
| Heat Cure Condition | 175ºC/5 hrs* | ||
*Thermal curing conditions during mold encapsulation
UV irradiation condition
1) UV ray intensity : 220 mW/cm2 2) UV ray dosage : 160 mJ/cm2 3) Wave length of ultraviolet should be around 365nm.
For FOW -chip to chip-
The indicated values are measured values and not intended for guarantee use.
| LE4777H | Measurement Method | ||
|---|---|---|---|
| Tape Thickness (µm) | 175 | Without Release Film | |
| Base Film Thickness (µm) | 100 | ||
| Adhesive Layer Thickness (µm) | 75 | ||
| Appearance | Brown | ||
| Pick Up Strength (N/5 mm X 5 mm) |
0.7 | ||
| Die Shear Strength (N/2 mm X 2 mm) |
200 (R.T.) | Adherent : Copper | |
| Glass transition temperature (ºC) | 204 | Elastic Data | |
| Storage Modulus (Pa) |
25ºC | 3.8 X 109 | Frequency : 11 Hz |
| 100ºC | 2.6 X 109 | ||
| 150ºC | 1.6 X 109 | ||
| 200ºC | 4.3 X 108 | ||
| 250ºC | 2.0 X 108 | ||
| CTE (ppm) | α1 | 50 | TMA |
| α2 | 130 | ||
| Moisture Absorption (wt%) | 1.0 | MSL1 : 85ºC, 85%RH/168 hrs | |
| Heat Cure Condition | 160ºC/60 min | ||
UV irradiation condition
1) UV ray intensity : 220 mW/cm2 2) UV ray dosage : 160 mJ/cm2 3) Wave length of ultraviolet should be around 365nm.