We offer various tapes.
Dicing Tape
（Non-UV type Dicing Tape）
For Si Wafer Blade Dicing
The indicated values are measured values and not intended for guarantee use.
| G-11D | G-19SHD | G-19D | G-64H | ||
|---|---|---|---|---|---|
| Tape Thickness(μm) | 80 | 75 | 80 | 85 | |
| Appearance | Black opaque | Black opaque | Black opaque | Opaque | |
| Structure | Base Film (μm) | PVC 70 |
PVC 70 |
PVC 70 |
PO 80 |
| Adhesive (μm) | 10 | 5 | 10 | 5 | |
| Adhesion*1 (mN/25 mm) |
300 | 990 | 1570 | 1000 | |
| RoHS2 compatible | ○ | ○ | ○ | ○ | |
*1 Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend: Si mirror wafer
For Full Cut Laser Dicing
The indicated values are measured values and not intended for guarantee use.
| G-967 | ||
|---|---|---|
| Tape Thickness(μm) | 110 | |
| Appearance | Transparent | |
| Structure | Base Film (μm) | Special Elastomer 100 |
| Adhesive (μm) | 10 | |
| Adhesion*1 (mN/25 mm) |
Before UV | 2940 |
*1 Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend: Si mirror wafer
For Transportation Use
The indicated values are measured values and not intended for guarantee use.
| G-64H | ||
|---|---|---|
| Tape Thickness(μm) | 85 | |
| Appearance | Opaque | |
| Structure | Base Film (μm) | PO 80 |
| Adhesive (μm) | 5 | |
| Adhesion*1 (mN/25 mm) |
1000 | |
| Remark | RoHS2 Compatible Non-PVC |
|
*1 Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend: Si mirror wafer
