BG Tape E series (UV Curable BG Tape) | Adwill:Semiconductor-related Products

We offer various tapes.

BG Tape （UV Curable BG Tape）

For Standard Back Grinding Process
-Standard (>100 μm wafer)-

The indicated values are measured values and not intended for guarantee use.

		E-6142S(S)	E-6152B	E-6170(S)
Tape Thickness(μm)		130	148	170
Appearance		Opaque	Blue	Opaque
Structure	Base Film (μm)	PO 110	PO 108	PO 110
Structure	Adhesive (μm)	20	40	60
Adhesion^*1 (mN/25 mm)	Before UV	5400	6740	11300
Adhesion^*1 (mN/25 mm)	After UV^*2	55	50	55
Remark		Standard	Clear Blue (Transparent)	For Low Bump

*1 Peeling speed= 300 mm/min, Peeling angle= 180deg. Adherend: Si mirror wafer

*2:UV ray intensity: 230 mW/cm², UV ray dosage 380 mJ/cm² Wavelength of ultraviolet should be around 365 nm.

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For Standard Back Grinding Process
-Thin Wafer (>40 μm wafer)-

The indicated values are measured values and not intended for guarantee use.

		E-8180HR
Tape Thickness(μm)		180
Appearance		Blue
Structure	Base Film (μm)	Special Elastomer 160
Structure	Adhesive (μm)	20
Adhesion^*1 (mN/25 mm)	Before UV	5390
Adhesion^*1 (mN/25 mm)	After UV^*2	250
Remark		Low Warpage

*1:Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend: Si mirror wafer

*2:UV ray intensity: 230 mW/cm², UV ray dosage 380 mJ/cm² Wavelength of ultraviolet should be around 365 nm.

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For Standard Back Grinding Process
-Anti-ESD-

The indicated values are measured values and not intended for guarantee use.

		E-6130AS	E-3090V AS
Tape Thickness(μm)		130	90
Appearance		Opaque	Blue
Structure	Base Film (μm)	PO 110	PET Composite Film 80
Structure	Adhesive (μm)	20	10
Adhesion^*1 (mN/25 mm)	Before UV	5700	11000
Adhesion^*1 (mN/25 mm)	After UV^*2	55	30
Surface Resistivity^*3 (Ω/□)	Before UV	1.0 x 10¹⁰	1.3 x 10¹⁰
Surface Resistivity^*3 (Ω/□)	After UV^*2	9.1 x 10¹²	4.3 x 10¹²
Remark			For DBG™

*1:Peeling speed= 300 mm/min, Peeling angle= 180deg. Adherend: Si mirror wafer

*2:UV ray intensity: 230 mW/cm², UV ray dosage 380 mJ/cm² Wavelength of ultraviolet should be around 365 nm.

*3:ADVANTEST DIGITAL ELECTROMETER R8252 ,Measurement : Adhesive side

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For Standard Back Grinding Process
-Bump Wafer-

The indicated values are measured values and not intended for guarantee use.

		E-4230BS	E-3281B	E-8310LS342F	E-8280	E-9486
Tape Thickness(μm)		230	280	310	280	485
Appearance		Blue	Blue	Blue	Blue	Transparent
Structure	Base Film (μm)	PO Composite Film 220	PET Composite Film 270	Special Elastomer 270	Special Elastomer 260	PET Composite Film 475
Structure	Adhesive (μm)	10	10	40	20	10
Adhesion^*1 (mN/25 mm)	Before UV	4165	16600	7600	9200	13000 (2600)^*3
Adhesion^*1 (mN/25 mm)	After UV^*2	220	2800	270	480	1200 (240)^*3
Remark		For <80μm Bump	For <100µm Bump for DBG™	For <100μm Bump	For <150μm Bump	For <250μm Bump for DBG™

*1: Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend: Si mirror wafer

*2: UV ray intensity: 230 mW/cm², UV ray dosage: 550 mJ/cm²(For E-8310LS342F, E-8280 was 380 mJ/cm² and E-9486 was 1120 mJ/cm2), Wavelength of ultraviolet should be around 365 nm.

*3: Peeling speed= 3000 mm/min, Peeling angle= 90deg., Adherend= Si mirror wafer

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For Special Process
-DBG™, SDBG/GAL Process-

The indicated values are measured values and not intended for guarantee use.

		E-3125BN	E-3100UN	E-3090V	E-3100V	E-3140V
Tape Thickness(μm)		125	100	90	100	140
Appearance		Blue	Blue	Blue	Blue	Blue
Structure	Base Film (μm)	PO Composite Film 105	PET Composite Film 80	PET Composite Film 80	PET Composite Film 80	PET Composite Film 80
Structure	Adhesive (μm)	20	20	10	20	60
Adhesion^*1 (mN/25 mm)	Before UV	10780	13430	11500	12600	15600
Adhesion^*1 (mN/25 mm)	After UV^*2	50	50	50	40	60
Remark		T.T.V. : Good	T.T.V. : Better	T.T.V. : Best	T.T.V. : Best	T.T.V. : Better

*1: Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend=Si mirror wafer

*2: UV ray intensity: 230 mW/cm², UV ray dosage: 380 mJ/cm², Wavelength of ultraviolet should be around 365 nm

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For Special Process
-Chemical Etching-

The indicated values are measured values and not intended for guarantee use.

		E-3129R	E-4141A	E-6142S(S)
Tape Thickness(μm)		120	140	130
Appearance		Blue	Opaque	Opaque
Structure	Base Film (μm)	PET Composite Film 80	PO 120	PO 110
Structure	Adhesive (μm)	40	20	20
Adhesion^*1 (mN/25 mm)	Before UV	9800	3630	5400
Adhesion^*1 (mN/25 mm)	After UV^*2	196	690	55

*1: Peeling speed= 300 mm/min, Peeling angle= 180deg., Adherend=Si mirror wafer

*2: UV ray intensity: 230 mW/cm², UV ray dosage: 380 mJ/cm², Wavelength of ultraviolet should be around 365 nm.

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*"DBG™" is trademark of LINTEC Corporation, Disco Corporation and KIOXIA Corporation.

"Stealth Dicing™" is trademark of Hamamatsu Photonics K.K.

BG Tape （UV Curable BG Tape）

For Standard Back Grinding Process -Standard (>100 μm wafer)-

For Standard Back Grinding Process -Thin Wafer (>40 μm wafer)-

For Standard Back Grinding Process -Anti-ESD-

For Standard Back Grinding Process -Bump Wafer-

For Special Process -DBG™, SDBG/GAL Process-

For Special Process -Chemical Etching-

For questions or estimations about semiconductor related products, please feel free to contact us.

For Standard Back Grinding Process
-Standard (>100 μm wafer)-

For Standard Back Grinding Process
-Thin Wafer (>40 μm wafer)-

For Standard Back Grinding Process
-Anti-ESD-

For Standard Back Grinding Process
-Bump Wafer-

For Special Process
-DBG™, SDBG/GAL Process-

For Special Process
-Chemical Etching-